期刊
IEEE MICROWAVE MAGAZINE
卷 21, 期 1, 页码 18-34出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/MMM.2019.2945157
关键词
Packaging; Metals; Probes; Substrates; Rectangular waveguides; Waveguide components; Micromachining
It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.
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