期刊
ACTA MATERIALIA
卷 189, 期 -, 页码 118-128出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2020.02.052
关键词
Lead-free solder; Electromigration; X-ray microtomography; Void growth; Intermetallics
资金
- National Science Foundation [NSF CMMI-1763128]
- Achievement Rewards for College Scientists (ARCS) Foundation through an ARCS Scholar Award
- Graduate College at Arizona State University
Electromigration (EM) causes intermetallic and void growth that decreases the reliability and lifetime of solder joints. As a diffusion-controlled process, EM is highly dependent on the fastest diffusion pathways in a structure. In anisotropic beta-tetragonal Sn those pathways are along high angle grain boundaries and along the c-axis of the Sn grains. A bicrystal sample with two major grain orientations and two major grain boundary types was EM tested for 100 h. EM was interrupted at intervals for x-ray microtomography to reveal the 3D evolution of intermetallic compounds (IMCs) and voids within the joint. Quantitative IMC growth along high angle grain boundaries and twins was captured for the first time and related to the effective Cu diffusivity of multiple grains. Using a correlative approach that combined scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) mapping, IMC growth and morphology were linked to the evolution of the Sn grain structure. Unusual void shrinkage and void splitting behavior were connected to uneven cathode interface consumption and thermal compression. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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