期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 9, 期 9, 页码 1872-1887出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2019.2919866
关键词
Bend testing; flexible electronics; flexible hybrid electronics (FHE); materials reliability; printed electronics; robustness; wearable sensors
类别
资金
- NanoBio Manufacturing Consortium through Air Force Research Laboratory [FA86501327311-7]
- Air Force Research Laboratory through FlexTech Alliance, Inc. [FA8650-15-2-5401]
Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of an FHE human performance monitor (HPM), designed to monitor electrocardiography (ECG) signals. The 50.8 mm x 50.8 mm HPM is fabricated on Kapton HN polyimide (PI) substrate with flexible gold (Au) ECG electrodes on one side of the substrate and rigid electronic components for signal processing and communication mounted on the other side of the substrate. Our previously reported HPMs demonstrated reliability issues due to: 1) cracking of the copper (Cu) circuitry and 2) thinning and lack of adhesion at the printed Au and plated Cu interface that connected printed sensors to the Cu circuitry. Both failure mechanisms resulted in electrical opens in the circuit, which caused device failure. We explored effects of different design parameters, such as PI substrate thickness (50 versus 125 mu m), Cu circuit thickness (2 versus 6 mu m), solder reflow temperature [205 degrees C for Tin-Lead (Sn-Pb) versus 175 degrees C for Tin-Bismuth (Sn-Bi) solder], solder pad design, and optimized inkjet printing (printing on bare Cu versus Au-plated Cu) on improving FHE reliability. Test vehicles (TVs) with different combinations of these factors were fabricated and bend-tested to determine the most robust configuration. TVs with 50-mu m-thick PI substrate, 6-mu m-thick Cu circuit, Sn-Bi solder, redesigned solder pads with rounded corners, and printed Au traces on Au plated Cu pads demonstrated the best reliability results.
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