期刊
THEORETICAL AND APPLIED FRACTURE MECHANICS
卷 103, 期 -, 页码 -出版社
ELSEVIER
DOI: 10.1016/j.tafmec.2019.102267
关键词
Uncoupled thermoelasticity; Finite element method; C-1-continuity elements; Higher-order heat conduction; Flexoelectricity
资金
- National Key R&D Program of China [2018YFC0808800]
- China Postdoctoral Science Foundation [2016M600405]
- innovation program for graduate students in Jiangsu Province of China [KYCX17_0935]
- China Scholarship Council (CSC)
- University of Strathclyde
The flexoelectric effect and higher-order heat conduction equation are considered for the fracture mechanics analysis of piezoelectric nano-sized structures under a thermal load. The variational principle is applied to the governing equations of generalized uncoupled thermoelasticity to obtain the formulation for the finite element method (FEM). In the numerical implementation of the FEM, the physical fields are approximated by conforming elements with C-1-continuity. Since uncoupled thermoelasticity is considered, the heat conduction problem is analyzed independently of the mechanical fields in the first step. The influence on the crack behaviour of the characteristic time parameter that occurs in generalized heat conduction is investigated in some numerical examples.
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