4.7 Article

Brazing temperature-dependent interfacial reaction layer features between CBN and Cu-Sn-Ti active filler metal

期刊

JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
卷 35, 期 10, 页码 2163-2168

出版社

JOURNAL MATER SCI TECHNOL
DOI: 10.1016/j.jmst.2019.05.041

关键词

Brazing temperature; CBN/Cu-Sn-Ti filler metal; Wettability; Reaction layer

资金

  1. National Natural Science Foundation of China [51622401, 51628402, 51861130361, 51861145312, 51850410522]
  2. Royal Society [RP12G0414]
  3. Research Fund for Central Universities [N172502004]
  4. National Key Research and Development Program of China [2016YFB0300602]
  5. Global Talents Recruitment Program endowed by the Chinese Government
  6. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University [SKLSP201805]

向作者/读者索取更多资源

CBN/Cu-Sn-Ti (CBN: cubic boron nitride) composites are prepared by active brazing sintering at 1123 K, 1173 K, 1223 K and 1273 K, respectively. The effects of brazing temperature on the wettability, interfacial characteristics, and elemental distribution variations are fully investigated. When the brazing temperature is below 1223 K, completely uncoated and/or partially coated CBN particles with sharp edges can still be observed, and the reaction layer, mainly composed of TiN and TiB2, appears to be thin and uneven. When the brazing temperature is 1223 K, all CBN particles are completely coated, suggesting that adequate wetting has taken place. Besides, as Ti diffuses thoroughly and enriches the interface, the reaction layer, filled primarily by TiN, TiB2 and TiB, becomes thicker (about 1.30 mu m), more uniform, stable and continuous. Further increasing the temperature to 1273 K is unnecessary or even harmful as the reaction layer thickness undergoes negligible change yet some tiny micro-cracks appear on the interface, which may likely deteriorate the grinding capability of the final brazing products. (C) 2019 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

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