4.6 Article

Package-in-Dielectric Liquid Patch Antenna Based on Liquid Metal Alloy

期刊

IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS
卷 18, 期 11, 页码 2360-2364

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LAWP.2019.2932048

关键词

Conductive liquid; EGaIn; liquid metal alloy; package-in-dielectric (PiD); three-dimensional (3-D) printing

资金

  1. National Natural Science Foundation of China [61801300]
  2. State Key Laboratory of Millimeter Waves [K201932]
  3. Foundation for Distinguished Young Talents in Higher Education of Guangdong Province, China [2017KQNCX173]

向作者/读者索取更多资源

A fully dielectric packaged liquid patch antenna based on liquid metal alloy is presented. In this letter, there are two hollow cavities embedded in a dielectric box, including a rectangular cavity placed at the upper portion acting as the radiating element, and a nonplanar cavity with a central groove under the radiating element serving as the ground plane. The antenna is realized by a three-dimensional printing technique, alleviating assembly tolerance, and uncertainties from a printed-circuit-board approach, which would degrade an antenna performance. The radiating element and the ground plane are fully metallized by filling liquid metal alloy. Unlike traditional liquid antennas, the liquid packaging antenna is completely metallized by conductive liquids, which does not contain any solid metals. The proposed antenna is designed to operate at 5.2 GHz. Results show that the proposed liquid patch antenna produces a satisfactory impedance matching, and a good agreement between simulation and measurement in terms of radiation characteristics is achieved at the desired frequency.

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