期刊
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS
卷 18, 期 11, 页码 2360-2364出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LAWP.2019.2932048
关键词
Conductive liquid; EGaIn; liquid metal alloy; package-in-dielectric (PiD); three-dimensional (3-D) printing
资金
- National Natural Science Foundation of China [61801300]
- State Key Laboratory of Millimeter Waves [K201932]
- Foundation for Distinguished Young Talents in Higher Education of Guangdong Province, China [2017KQNCX173]
A fully dielectric packaged liquid patch antenna based on liquid metal alloy is presented. In this letter, there are two hollow cavities embedded in a dielectric box, including a rectangular cavity placed at the upper portion acting as the radiating element, and a nonplanar cavity with a central groove under the radiating element serving as the ground plane. The antenna is realized by a three-dimensional printing technique, alleviating assembly tolerance, and uncertainties from a printed-circuit-board approach, which would degrade an antenna performance. The radiating element and the ground plane are fully metallized by filling liquid metal alloy. Unlike traditional liquid antennas, the liquid packaging antenna is completely metallized by conductive liquids, which does not contain any solid metals. The proposed antenna is designed to operate at 5.2 GHz. Results show that the proposed liquid patch antenna produces a satisfactory impedance matching, and a good agreement between simulation and measurement in terms of radiation characteristics is achieved at the desired frequency.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据