4.3 Article

Unhooking of an interstrand cross-link at DNA fork structures by the DNA glycosylase NEIL3

期刊

DNA REPAIR
卷 86, 期 -, 页码 -

出版社

ELSEVIER
DOI: 10.1016/j.dnarep.2019.102752

关键词

DNA-DNA interstrand cross-link; ICL; Replication-dependent DNA repair; Unhooking; NEIL3; DNA glycosylase; Abasic site; AP-derived cross-link

资金

  1. NIH [R01E5021007, R01GM131071]
  2. Molecular Biophysics Training Program [T32GM008320]
  3. NSF Graduate Research Fellowship [DGE-1445197]

向作者/读者索取更多资源

Interstrand DNA-DNA cross-links (ICLs) are generated by endogenous processes, drugs, and environmental toxins. Understanding the cellular pathways by which various ICLs are repaired is critical to understanding their biological effects. Recent studies showed that replication-dependent repair of an ICL derived from the reaction of an abasic (AP) site with an adenine residue (dA) on the opposing strand of duplex DNA proceeds via a novel mechanism in which the DNA glycosylase NEIL3 unhooks the ICL. Here we examined the ability of the glycosylase domain of murine NEIL3 (MmuNEIL3-GD) to unhook dA-AP ICLs. The enzyme selectively unhooks the dAAP ICL located at the duplex/single-strand junction of splayed duplexes that model the strand-separated DNA at the leading edge of a replication fork. We show that the ability to unhook the dA-AP ICL is a specialized function of NEIL3 as this activity is not observed in other BER enzymes. Importantly, NEIL3 only unhooks the dA-AP ICL when the AP residue is located on what would be the leading template strand of a model replication fork. The same specificity for the leading template strand was observed with a 5,6-dihydrothymine monoadduct, demonstrating that this preference is a general feature of the glycosylase and independent of the type of DNA damage. Overall, the results show that the glycosylase domain of NEIL3, lacking the C-terminal NPL4 and GRF zinc finger motifs, is competent to unhook the dA-AP ICL in splayed substrates and independently enforces important substrate preferences on the repair process.

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