4.6 Review

Recent progress of residual stress measurement methods: A review

期刊

CHINESE JOURNAL OF AERONAUTICS
卷 34, 期 2, 页码 54-78

出版社

ELSEVIER SCIENCE INC
DOI: 10.1016/j.cja.2019.10.010

关键词

Destructive testing; Future trends; Measurement; Nondestructive testing; Residual stress

资金

  1. Science Challenge Project of China [TZ2016006-0103, TZ2016006010702]
  2. LiaoNing Revitalization Talents Program of China [XLYC1807230]
  3. Science Fund for Creative Research Groups of NSFC [51621064]
  4. Fundamental Research Funds for the Central Universities of China [DUT17RC (3) 105]
  5. National Natural Science Foundation of China [51975096]

向作者/读者索取更多资源

Residual stress is a significant factor affecting the mechanical properties of materials, and measuring and evaluating it is crucial for real applications. This paper reviews the research on residual stress measurement methods over the past five years, summarizes the existing problems of each technology, and forecasts future trends.
Residual stress is one of the main factors affecting the mechanical properties of materials, such as their strength, plasticity and surface integrity. For instance, tensile stress conditions can adversely affect material performance or component life, while compressive stress conditions can improve material fatigue strength. During the processing of integrated aviation structures, machining deformation caused by residual stress has become one of the most prominent manufacturing problems. Therefore, it is very important to measure and evaluate the stress for real applications. This paper reviews the research of residual stress measurement methods over the past five years by classifying them according to the measurement methods appearing in each stage. The existing problems and difficulties of each measurement technology are summarized, and future trends are forecasted. This paper provides a reference for further in-depth study of residual stress measurement technologies. ? 2019 Chinese Society of Aeronautics and Astronautics. Production and hosting by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

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