Thermal shock fracture of a crack in a functionally gradient half-space based on the memory-dependent heat conduction model

In the present study, we consider a thermoelastic half-space made of a functionally gradient material with an insulated crack, which is subjected to a thermal impact. The memory-dependent heat conduction model is adopted for analysis. By using the Fourier and Laplace transforms, the thermoelastic problem is formulated in terms of singular integral equations which can be solved numerically. Effects of the time delay, kernel function, and nonho-mogeneity parameters on the temperature and stress intensity factor are analyzed. Our results are also compared with those based on the Fourier and CV heat conduction models, which can be viewed as two special cases of the present model. In conclusion, the memory-dependent derivative and nonho-mogeneity parameters play an essential role in controlling the heat transfer process. (C) 2019 Elsevier Inc. All rights reserved.