期刊
ACS APPLIED MATERIALS & INTERFACES
卷 11, 期 46, 页码 43543-43552出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsami.9b14476
关键词
two-sided topological architecture; ultrasensitive strain sensors; wearable electronics; binary architecture; shear stiffening
资金
- National Natural Science Funds for Excellent Young Scholars of China [61822106]
- Natural Science Foundation of China [61671115, 61875031]
- International Cooperation Project of Science and Technology Department of Sichuan Province [2019YFH0015]
Flexible ultrasensitive strain sensors are highly desirable in view of their widespread applications in wearable electronics, health monitoring systems, and smart robots, where subtle strain detection is required. However, traditional fabrication of such sensors was done to prepare sensitive layers on bare or single-sided structural substrates, leading to limited sensitivity. Herein, a stretchable resistive-type strain sensor was demonstrated by self-assembling conductive networks onto a monolithic polydimethylsiloxane substrate with a two-sided topological design, for example, a sinusoid/auxetic binary architecture. The sensitivity of the obtained sensor was greatly improved by 22-fold as compared to the traditional counterpart with a bare substrate. The remarkably good agreement between the experimental results and finite element analysis predictions confirmed that the superior sensitivity is a synergistic effect of local strain enhancement derived from the topological structure on the foreside and an additional strain concentration and a reduced Poisson's ratio from the auxetic arrays on the backside. Furthermore, this sensor can withstand an extreme mechanical force (>750 N) because of the shear stiffening characteristic of the auxetic structure. Benefiting from the characteristics of ultrahigh sensitivity (gauge factor similar to 1744 at 5%), low detection limit (<0.05%), and long-term durability (>500 loading cycles), this as-prepared sensor shows promise in practical applications of high-performance wearable electronics.
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