期刊
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
卷 34, 期 12, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/1361-6641/ab4781
关键词
AlGaN HFET; AlGaN MOSHFET; high Al composition; insulating gate; atomic layer deposition; threshold voltage; fixed interface charges
类别
资金
- DARPA DREAM [ONR N00014-18-1-2033]
- ARO [W911NF-18-1-0029]
- National Science Foundation (NSF), ECCS Award [1711322, 1810116]
- MURI program
- University of South Carolina through the ASPIRE program
- Office of Naval Research
- Directorate For Engineering
- Div Of Electrical, Commun & Cyber Sys [1810116, 1711322] Funding Source: National Science Foundation
We report on Al0.65Ga0.35N/Al0.4Ga0.6N metal oxide semiconductor heterojunction field-effect transistor (MOSHFET) with high-k ZrO2 gate-dielectric deposited using atomic layer deposition process. As extracted from frequency dependent capacitance-voltage (CV) characteristics, the oxide gates resulted in an interfacial state trap density of similar to 2 x 10(12) cm(-2). A comparative study, on the same material, shows the gate-leakage current of the ZrO2 MOSHFETs to be lower by five orders; their ON/OFF current ratio (similar to 10(7)) to be higher by about four orders and their threshold voltage to decrease (less negative) by 3.5 V with respect to the Schottky gate devices.
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