Grain boundary inter-connections of Σ5 boundaries in a high purity iron with a uniform microstructure

Electron backscatter diffraction was used to measure the grain boundary character distribution of high purity (99.999%) iron with a uniform microstructure produced by multi-directional forging and recrystallization. Subsets of the grain boundaries were analyzed by the five-parameter method and it was found that grain boundary inter-connections of Sigma 5 boundaries had a strong preference for {0 1 3}/{0 1 3}. A crystallographic analysis indicates that the {0 1 3}/{0 1 3} grain boundary inter-connection is exactly located on the closest packed plane of the Sigma 5 coincidence site lattice. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.