4.7 Article

Multi-Micron Silicon Photonics Platform for Highly Manufacturable and Versatile Photonic Integrated Circuits

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSTQE.2019.2911432

关键词

Photonic integrated circuits; integrated optics; silicon photonics; photonic integration; optical interconnects; opto-electronics; hybrid lasers; III-V hybrid integration

资金

  1. Tekes under project DEEPSIMOD [5910/31/2017]
  2. Tekes under project RAPSI [55388]
  3. Tekes under project OPEC [2814/31/2015]
  4. Business Finland

向作者/读者索取更多资源

We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturahility, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-lass filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据