期刊
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
卷 25, 期 5, 页码 -出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSTQE.2019.2911432
关键词
Photonic integrated circuits; integrated optics; silicon photonics; photonic integration; optical interconnects; opto-electronics; hybrid lasers; III-V hybrid integration
资金
- Tekes under project DEEPSIMOD [5910/31/2017]
- Tekes under project RAPSI [55388]
- Tekes under project OPEC [2814/31/2015]
- Business Finland
We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturahility, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-lass filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.
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