期刊
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
卷 25, 期 5, 页码 -出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSTQE.2019.2908551
关键词
Silicon photonics; silicon-on-insulator; photonic integrated circuits; foundries
资金
- RAPSI - Business Finland [55388]
- OPEC - Tekes [2814/31/2015]
- RAPIDO [619806]
- PASSION [780326]
- MIREGAS [644192]
- PIXAPP [731954]
- ACTPHAST - European Commission [619205]
- Academy of Finland Flagship Programme, Photonics Research and Innovation (PREIN) [320168]
This paper gives an overview of the 3-mu m silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (similar to 0.1 dB/cm), ultradense integration (mu m-scale bends), small polarization dependency (down-to-zero birefringence), and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150-mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs, and small-to-medium volume manufacturing.
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