4.6 Article

Vertical Ga2O3 Schottky Barrier Diodes With Small-Angle Beveled Field Plates: A Baliga's Figure-of-Merit of 0.6 GW/cm2

期刊

IEEE ELECTRON DEVICE LETTERS
卷 40, 期 9, 页码 1399-1402

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2019.2931697

关键词

Gallium oxide; Schottky diodes; substrate thinning; non-punch-through; field plate; bevel edge termination

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This letter demonstrates vertical Ga2O3 Schottky barrier diodes (SBDs) with a novel edge termination, the small-angle beveled field plate (SABFP), fabricated on thinned Ga2O3 substrates. Non-punch-though design is used for the drift region with a donor concentration of 3 similar to 3.5 x 10(16)cm(-3), rendering a device differential ON-resistance of similar to 2 m Omega . cm(2). A new wet-etch technique is developed by using a bi-layer mask, which consists of spin-on-glass (SOG) and plasma-enhanced chemical vapor deposited (PECVD) SiO2, to fabricate a very small bevel angle (similar to 1 degrees) in the mesa and field plates. This SABFP structure facilitates the electric field spreading at device edges, rendering a breakdown voltage of 1100 V, a peak electric field of 3.5 MV/cm in Ga2O3 at the Schottky contact edge, and an averaged electric field over 3.4 MV/cm underneath the contact. Our device demonstrates a Baliga's figure of merit of 0.6 GW/cm(2), which is among the highest in all reported Ga2O3 power devices and comparable to the state-of-the-art GaN SBDs. These results show the great potential of Ga2O3 SBDs for future power applications.

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