期刊
ADVANCED MATERIALS
卷 31, 期 40, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201904085
关键词
3D printing; direct laser writing; laser lithography; photocleavage; two-photon polymerization
类别
资金
- Helmholtz program Science and Technology of Nanosystems (STN)
- Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany's Excellence Strategy via the Excellence Cluster 3D Matter Made to Order [EXC-2082-390761711]
- Carl Zeiss Foundation through the Carl-Zeiss-Focus@HEiKA
- Australian Research Council (ARC)
The ability to selectively remove sections from 3D-printed structures with high resolution remains a current challenge in 3D laser lithography. A novel photoresist is introduced to enable the additive fabrication of 3D microstructures at one wavelength and subsequent spatially controlled cleavage of the printed resist at another wavelength. The photoresist is composed of a difunctional acrylate cross-linker containing a photolabile o-nitrobenzyl ether moiety. 3D microstructures are written by photoinduced radical polymerization of acrylates using Ivocerin as photoinitiator upon exposure to 900 nm laser light. Subsequent scanning using a laser at 700 nm wavelength allows for the selective removal of the resist by photocleaving the o-nitrobenzyl group. Both steps rely on two-photon absorption. The fabricated and erased features are imaged using scanning electron microscopy (SEM) and laser scanning microscopy (LSM). In addition, a single wire bond is successfully eliminated from an array, proving the possibility of complete or partial removal of structures on demand.
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