4.7 Article

Influence of strain rate on subsolvus dynamic and post-dynamic recrystallization kinetics of Inconel 718

期刊

ACTA MATERIALIA
卷 174, 期 -, 页码 406-417

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2019.05.061

关键词

Inconel 718; Processing; Dynamic recrystallization; Post-dynamic recrystallization; Strain rate

资金

  1. French Agency for Scientific Research (ANR)
  2. Safran group via the industrial chair ANR-Safran OPALE

向作者/读者索取更多资源

Influence of strain rate on dynamic and post-dynamic recrystallization kinetics of Inconel 718 is investigated by performing hot compression tests at constant strain rate in the range [0.001;1]s(-1) in the delta-subsolvus domain, with or without post-deformation holding at the deformation temperature. Dynamically and post-dynamically recrystallized grains are distinguished based on their internal misorientations, using EBSD data with enhanced angular resolution. For the applied deformation conditions (T = 980 degrees C and epsilon = 0.7), dynamic recrystallization is inhibited at (epsilon)over dot > 0.1s(-1). On the other hand, very fast post-dynamic recrystallization is promoted by high strain rates, with characteristic times which can be as short as few seconds to achieve full recrystallization. Most of previous works on the effect of strain rate on dynamic recrystallization kinetics were done by quenching samples right after deformation, without discriminating dynamically and post-dynamically recrystallized grains. Those works led to the conclusion that increasing strain rate beyond a critical value leads to an increase in dynamic recrystallization kinetics. Experimental quenching delays cannot be shorter that few seconds, which is shown here to be sufficient to get a significant increase in recrystallized fraction by post-dynamic mechanisms. Based on the present work, post-dynamic evolutions are actually very likely to be responsible for the apparent increase in dynamic recrystallization kinetics at high strain rates which has often been reported previously. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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