Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits

Recent advances in flexible electronics have highlighted the importance of high throughput, digital additive microfabrication techniques. In this work, we demonstrate the combination of laser printing and laser sintering of a novel copper nanoparticle ink onto flexible substrates in order to produce oxide free conductive copper patterns in ambient atmospheric conditions. The printed patterns exhibit high reproducibility, very low resistivity (about 2x bulk), and negligible oxidation according to Raman spectroscopy. The process has been employed for the fabrication of an on-chip antenna on a flexible substrate for use in combination with a flexible circuit, in applications where a small form factor and simplicity of integration are required alongside ultra-low cost, e.g. consumable tagging. (C) 2019 Optical Society of America under the terms of the OSA Open Access Publishing Agreement