4.7 Article

Strength and ductility of bulk Cu/Nb nanolaminates exposed to extremely high temperatures

期刊

SCRIPTA MATERIALIA
卷 166, 期 -, 页码 73-77

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2019.03.007

关键词

Cu-Nb; Interface; Strength; Thermal stability; Hall-Petch relation

资金

  1. Hundred Talents Project of Chinese Academy of Sciences
  2. Thousand Youth Talents Plan of China
  3. National Natural Science Foundation of China [51771201]
  4. Shenyang National Laboratory for Materials Science [2017RP17]
  5. U.S. Dept of Energy, Office of Basic Energy Sciences Program [DE-SC0018901]
  6. U.S. Department of Energy (DOE) [DE-SC0018901] Funding Source: U.S. Department of Energy (DOE)

向作者/读者索取更多资源

In this work, we investigate the tensile strength and ductility of bulk Cu/Nb nanolaminates after exposure to high temperatures. We show that the interface transforms from flat to wavy at a transition temperature of 700 degrees C, and tensile strength is linearly proportional to H-1/2 (H = layer thickness). Moreover, the wavy interfaces give rise to a higher slope of the Hall-Petch law. This result can be attributed to greater resistance to slip transmission across wavy interfaces compared to planar interfaces. After 1000 degrees C for 1 h, the material still exhibits a high strength of 468 MPa and enhanced elongation. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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