期刊
SCRIPTA MATERIALIA
卷 166, 期 -, 页码 73-77出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2019.03.007
关键词
Cu-Nb; Interface; Strength; Thermal stability; Hall-Petch relation
类别
资金
- Hundred Talents Project of Chinese Academy of Sciences
- Thousand Youth Talents Plan of China
- National Natural Science Foundation of China [51771201]
- Shenyang National Laboratory for Materials Science [2017RP17]
- U.S. Dept of Energy, Office of Basic Energy Sciences Program [DE-SC0018901]
- U.S. Department of Energy (DOE) [DE-SC0018901] Funding Source: U.S. Department of Energy (DOE)
In this work, we investigate the tensile strength and ductility of bulk Cu/Nb nanolaminates after exposure to high temperatures. We show that the interface transforms from flat to wavy at a transition temperature of 700 degrees C, and tensile strength is linearly proportional to H-1/2 (H = layer thickness). Moreover, the wavy interfaces give rise to a higher slope of the Hall-Petch law. This result can be attributed to greater resistance to slip transmission across wavy interfaces compared to planar interfaces. After 1000 degrees C for 1 h, the material still exhibits a high strength of 468 MPa and enhanced elongation. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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