4.6 Article

3D printed microstructures for flexible electronic devices

期刊

NANOTECHNOLOGY
卷 30, 期 41, 页码 -

出版社

IOP PUBLISHING LTD
DOI: 10.1088/1361-6528/ab2d5d

关键词

3D microprinting; 3D microstructure; IPL-780 photoresist; 3D electronics; flexible electronics

资金

  1. City University of Hong Kong [9610423]
  2. Research Grants Council of the Hong Kong SAR [21205016, 11215817]
  3. National Natural Science Foundation of China [11402134]

向作者/读者索取更多资源

Flexible and stretchable electronics have attracted increasing attention and been widely used in wearable devices and electronic skins, where the circuits for flexible and stretchable electronics are typically in-plane-based 2D geometries. Here, we introduce a 3D microprinting technology that can expand one more dimension of the circuit in flexible electronics. We fabricated three-dimensional serpentine microstructures based on direct laser writing. These microstructures with a thin metal coated layer can be used as stretchable conducting meshes. Soft silicone serving as a substrate and encapsulations for these 3D microstructures enables great light transmittance (>90% in visible light range) and flexibility with 114 degrees bending and 24 degrees twisting. Further optimization of the mechanical design of the 3D microstructures can also enhance the stretchability up to 13.8%. These results indicate 3D flexible electronics can be realized by simple microprinting methods. Furthermore, 3D microprinting would also allow for the precise fabrication of other 3D structures, such as mechanically active 3D mesostructures, for the function of mechanical and electrical testing.

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