Integrated thermal control and system assessment in plug-chip spray cooling enclosure

Practical and integrated spray cooling system is urgently needed for the cooling of high-performance electronic chips due to the growth requirements of thermal management in workstation. The integration of multi heat sources and the management of integral system are particularly lacking. In order to fill the vacancies in the study of plug-chip spray cooling, an integrated cooling enclosure was designed in this paper. Multi heat sources were placed in sealed space and the heat was removed by spray. The printed circuit board plug-ins and radio frequency resistors were used as analog motherboards and chips, respectively. The enhanced surfaces with four different geometries and the plain surface were studied under the conditions of different inclination angles. The results were compared and the maximum critical heat flux (CHF) was obtained. Moreover, with the intention of the overall management of multi-heat source in integrated enclosure, the effect of the flow rate and the temperature disequilibrium, and the pulse heating in the process of transient cooling were also analyzed. In addition, a comprehensive assessment system, used to evaluate the practicality of spray cooling experimental devices, was proposed and the performance of enclosure was evaluated. (C) 2016 Elsevier Ltd. All rights reserved.