Characterization of channel temperature in Ga2O3 metal-oxide-semiconductor field-effect transistors by electrical measurements and thermal modeling

The channel temperature (T-ch) and thermal resistance (R-th) of Ga2O3 metal-oxide-semiconductor field-effect transistors were investigated through electrical measurements complemented by electrothermal device simulations that incorporated experimental Ga2O3 thermal parameters. The analysis technique was based on a comparison between DC and pulsed drain currents (I-DS) at known applied biases, where negligible self-heating under pulsed conditions enabled approximation of T-ch to the ambient temperature (T-amb) and hence correlation of I-DS to T-ch. Validation of the device model was achieved through calibration against the DC data. The experimental T-ch was in good agreement with simulations for T-amb between 20 degrees C and 175 degrees C. A large R-th of 48 mm.K/W thus extracted at room temperature highlights the value of thermal analysis for understanding the degradation mechanisms and improving the reliability of Ga2O3 power devices. Published by AIP Publishing.