相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Internal modification of glass by ultrashort laser pulse and its application to microwelding
Isamu Miyamoto et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2014)
Evaluation of Molten Zone in Micro-welding of Glass by Picosecond Pulsed Laser
Yasuhiro Okamoto et al.
JOURNAL OF LASER MICRO NANOENGINEERING (2013)
Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating
N. Lorenz et al.
MICROELECTRONICS RELIABILITY (2011)
Characteristics of laser absorption and welding in FOTURAN glass by ultrashort laser pulses
Isamu Miyamoto et al.
OPTICS EXPRESS (2011)
Systematic Optimisation of Process Parameters in Laser Drilling of 200 μm Photovoltaic Silicon Wafers Using New Kind of Nanosecond IR Lasers
Klaus-Peter Stolberg et al.
JOURNAL OF LASER MICRO NANOENGINEERING (2009)
Wafer level packaging technology for silicon resonators
J. Baborowski et al.
PROCEEDINGS OF THE EUROSENSORS XXIII CONFERENCE (2009)
Investigations on ultrafast welding of glass-glass and glass-silicon
Alexander Horn et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2008)
Theory analysis of wavelength dependence of laser-induced phase explosion of silicon
Quanming Lu et al.
JOURNAL OF APPLIED PHYSICS (2008)
Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm
Takayuki Tamaki et al.
OPTICS EXPRESS (2006)
Low temperature wafer anodic bonding
J Wei et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2003)
Local laser bonding for low temperature budget
UM Mescheder et al.
SENSORS AND ACTUATORS A-PHYSICAL (2002)
Locally selective bonding of silicon and glass with laser
MJ Wild et al.
SENSORS AND ACTUATORS A-PHYSICAL (2001)
Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
YT Cheng et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2000)
分享论文
