Effect of wavelength and pulse duration on laser micro-welding of monocrystalline silicon and glass

Micro-welding characteristics of silicon and glass by pulsed lasers are described. In this study, four types of laser beam, which are nanosecond pulsed laser and picosecond pulsed laser of 532 and 1064 nm in wavelength, were used for joining monocrystalline silicon and glass. Influence of wavelength and pulse duration on micro-welding of monocrystalline silicon and glass was experimentally investigated under the same spot diameter, and the molten area of monocrystalline silicon and glass was characterized. Finally, the breaking strength was evaluated for the overlap weld joint with different pulse duration and wavelength. A splash area of molten silicon around the weld bead line was obvious in the nanosecond pulsed laser. On the other hand, there was no remarkable molten splash around the weld bead line in the picosecond pulsed laser. Breaking strength of specimens with 1064 nm wavelength was higher than with 532 nm wavelength in nanosecond laser, whereas breaking strength of laser-irradiated specimen by picosecond pulse duration was higher than that by nanosecond pulse duration. It is concluded that the combination of picosecond pulse duration and infrared wavelength leads to the stable molten area appearance of the weld bead and higher breaking strength in microwelding of glass and monocrystalline silicon.