期刊
COMPOSITES SCIENCE AND TECHNOLOGY
卷 177, 期 -, 页码 118-126出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.compscitech.2019.04.026
关键词
Polymer-matrix composites (PMCs); Thermal properties; Interface; Nano composites; Nano particles
资金
- National Key RD Project [2017YFB0406000]
- Frontier Sciences Key Research Program of the Chinese Academy of Sciences [QYZDY-SSW-JSC010]
- National Natural Science Foundation of China [51603226]
- R&D Funds for basic Research Program of Shenzhen [JCYJ20150831154213681]
- National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Committee) [2017-934]
- Shenzhen international cooperation project [GJHZ20180420180909654]
Enhancing the thermal conductivity of polymers is important for their critical applications in all heat exchangers and electronic packaging. However, owing to the existence of interfacial thermal resistance (ITR), the overall thermal conductivity of the polymer composites cannot meet the requirements of the electronics industry. Here, we propose an approach to decreasing the ITR by both improving the contact area and the interconnection between fillers. An increase in out-of-plane thermal conductivity (0.804 W m(-1) K-1) is observed in the silver nanoparticles (AgNPs)-boron nitride nanosheet (BNNS)/silver nanowires (Ag NW)/epoxy composites, which is 2.4 times higher than that of the BNNS/epoxy composites. Fitting the measured thermal conductivity of composites with Foygel model indicates that ITR can be reduced effectively when the contact and the interactions of the fillers is optimized. The proposed design methodology here potentially paves the way for designing and preparing higher thermal conductive materials in the future.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据