期刊
ADVANCED FUNCTIONAL MATERIALS
卷 29, 期 37, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.201903120
关键词
2D materials; black phosphorus; chiral; heterostructures; nanostructures; self-assembly
类别
资金
- European Research Council (ERC Starting Grant 2DNanoCaps)
- European Research Council (ERC TC2D)
- European Research Council (ERC CoG 3D2DPrint)
- European Research Council (ERC CoG Picometrics)
- FP7 ITN (MoWSeS)
- SFI (PIYRA)
- SFI (AMBER)
- EPSRC [EP/P033555/1, EP/R029431]
- Research Foundation Flanders (FWO, Belgium)
- GOA project Solarpaint of the University of Antwerp
- Flemish Government
- Center for Nanophase Materials Sciences
- Engineering and Physical Sciences Research Council (EPSRC)
- Science Foundation Ireland [HPC_16_00932]
- SFI
- EPSRC [EP/R029431/1, EP/P033555/1] Funding Source: UKRI
The fabrication of 2D systems for electronic devices is not straightforward, with top-down low-yield methods often employed leading to irregular nanostructures and lower quality devices. Here, a simple and reproducible method to trigger self-assembly of arrays of high aspect-ratio chiral copper heterostructures templated by the structural anisotropy in black phosphorus (BP) nanosheets is presented. Using quantitative atomic resolution aberration-corrected scanning transmission electron microscopy imaging, in situ heating transmission electron microscopy and electron energy-loss spectroscopy arrays of heterostructures forming at speeds exceeding 100 nm s(-1) and displaying long-range order over micrometers are observed. The controlled instigation of the self-assembly of the Cu heterostructures embedded in BP is achieved using conventional electron beam lithography combined with site specific placement of Cu nanoparticles. Density functional theory calculations are used to investigate the atomic structure and suggest a metallic nature of the Cu heterostructures grown in BP. The findings of this new hybrid material with unique dimensionality, chirality, and metallic nature and its triggered self-assembly open new and exciting opportunities for next generation, self-assembling devices.
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