4.6 Article

Preparation and Properties of Poly(imide-siloxane) Copolymer Composite Films with Micro-Al2O3 Particles

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APPLIED SCIENCES-BASEL
卷 9, 期 3, 页码 -

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MDPI
DOI: 10.3390/app9030548

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poly(imide-siloxane) copolymer; Al2O3; thermal conductivity; heat-dissipating

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In the current study, poly(imide-siloxane) copolymers (PIs) with different siloxane contents were synthesized and used as a matrix material for PI/Al2O3 composites. The PIs were characterized via their molecular weight, film quality, and thermal stability. Among the PI films, free-standing and flexible PI films were selected and used to prepare PI/Al2O3 composite films, with different Al2O3 loadings. The thermal conductivity, thermal stability, mechanical property, film flexibility, and morphology of the PI/Al2O3 composite films were investigated for their application as heat-dissipating material.

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