期刊
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
卷 20, 期 1, 页码 421-444出版社
TAYLOR & FRANCIS LTD
DOI: 10.1080/14686996.2019.1591168
关键词
Sn-Cu; microstructures; IMC; mechanical properties
资金
- National Key R&D Program of China [2017YFB0305700]
- Natural Science Foundation of China [51475220]
- Key project of State Key Laboratory of Advanced Welding and Joining [AWJ19Z04]
- Six talent peaks project in Jiangsu Province [XCL-022]
- Qing Lan Project
- China Postdoctoral Science Foundation [2016M591464]
- [2015DFA50470]
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. [GRAPHICS] .
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