期刊
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
卷 29, 期 6, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/1361-6439/ab18f1
关键词
electrodeposition; micro-thermoelectric device; MEMS fabrication; energy-harvesting
类别
资金
- European Union [644453]
- SFI [15/IA/3160]
- Science Foundation Ireland (SFI)
- European Regional Development Fund [13/RC/2077]
- Horizon 2020 research and innovation programme [825114]
This work demonstrates and discusses the fabrication of cross-plane configured micro thermoelectric devices for the power generation and thermal management of the photonic devices. The device is fabricated using a cost-effective electrodeposition technique on the silicon wafer with 210 pairs of the electrodeposited p-type BiTe and n-type CuTe pillars. The complete device is fabricated using the flip-chip bonding technique. Our focus in this work is on the challenges in the device fabrication and the solutions employed to overcome the obstacles thereby successfully fabricating the micro thermoelectric device.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据