相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating
Chao Huang et al.
JOURNAL OF ELECTRONIC MATERIALS (2019)
Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB
Jungsoo Kim et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment
Ruyu Tian et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Multiscale modeling of crystal plasticity in Reactor Pressure Vessel steels: Prediction of irradiation hardening
Ghiath Monnet et al.
JOURNAL OF NUCLEAR MATERIALS (2019)
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling
Li Yang et al.
MATERIALS CHARACTERIZATION (2019)
Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn-58Bi and Cu Pad
Ashutosh Sharma et al.
METALS AND MATERIALS INTERNATIONAL (2019)
Interfacial Behaviors in Cu/Molten Sn-58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing
Fengjiang Wang et al.
ELECTRONIC MATERIALS LETTERS (2019)
2018 IndexIEEE Transactions on MagneticsVol. 54
IEEE TRANSACTIONS ON MAGNETICS (2019)
Corrosion characterization of Sn-Zn solder: a review
Muhammad Firdaus Mohd Nazeri et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2019)
Recrystallization Behavior in SAC305 and SAC305+3.0POSS Solder Joints Under Thermal Shock
Jing Han et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate
Wei-Jhen Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints
Yong Zuo et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys
Raj K. Kaushik et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2018)
Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock
Yong-Gue Sung et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
Y. Tang et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
F. Q. Hu et al.
MATERIALS LETTERS (2018)
Role of cerium in microstructure and corrosion properties of Sn-1.0Ag solder alloys
B. X. Vuong et al.
MATERIALS LETTERS (2018)
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
Bingfeng Guo et al.
MATERIALS RESEARCH BULLETIN (2018)
Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock
Ruyu Tian et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2018)
The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints
Yu Tian et al.
MICROELECTRONICS RELIABILITY (2018)
Mossbauer studies of β → α phase transition in Sn-rich solder alloys
Piotr Zachariasz et al.
MICROELECTRONICS RELIABILITY (2018)
Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys
Eric Dalton et al.
MATERIALS & DESIGN (2018)
Simulation study of single event effects in the SiC LDMOS with a step compound drift region
Meng-tian Bao et al.
MICROELECTRONICS RELIABILITY (2018)
Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles
Yanni Wen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications
Ashutosh Sharma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties
Xiaoxuan Tu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints
Z. L. Li et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints
Y. Tang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Life cycle energy benefits of carbon nanotubes for electromagnetic interference (EMI) shielding applications
Leila Pourzahedi et al.
JOURNAL OF CLEANER PRODUCTION (2017)
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
Li-Yin Gao et al.
JOURNAL OF ELECTRONIC MATERIALS (2017)
Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint
Fengjiang Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2017)
Study on the Reliability of Carbon Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints
Li Yang et al.
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE (2017)
Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability
F. Khodabakhshi et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2017)
Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
Ruyu Tian et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2017)
Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys
Xuezheng Li et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2017)
Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder
Yong Ma et al.
MATERIALS & DESIGN (2017)
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
Yuan-Wei Chang et al.
SCIENTIFIC REPORTS (2017)
The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing
Ting-Hui Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Effects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn-Zn solder alloys
Jian-Chun Liu et al.
CORROSION SCIENCE (2016)
Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing
Yi Li et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders
Limin Ma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets
Dongliang Ma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints
Chao-hong Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Corrosion resistance of ternary Sn-9Zn-xIn solder joint in alkaline solution
Muhammad Firdaus Mohd Nazeri et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections
Guang Ren et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
Mrunali Sona et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Woo-Ram Myung et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB
Jungsoo Kim et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics
Won Sik Hong et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration
M. Nasir Bashir et al.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY (2016)
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
Ying Zhong et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging
Lizhuang Yang et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Correlation between microstructure and mechanical properties of Sn-Bi-X solders
Omid Mokhtari et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
Hsi-Kuei Cheng et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2016)
Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints
Zhenyu Zhao et al.
MICROELECTRONICS RELIABILITY (2016)
Corrosion resistance of tin coatings deposited by cold spraying
M. Winnicki et al.
SURFACE ENGINEERING (2016)
Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn-8Zn-3Bi Alloy
Xin Zhang et al.
METALS (2016)
Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys
Balazs Illes et al.
CORROSION SCIENCE (2015)
The role of Zn precipitates and Cl- anions in pitting corrosion of Sn-Zn solder alloys
Jian-Chun Liu et al.
CORROSION SCIENCE (2015)
Engineering Electrical Interfaces to Silicon via Indium Solder
Robert M. Panas et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2015)
Ti addition to enhance corrosion resistance of Sn-Zn solder alloy by tailoring microstructure
Jian-Chun Liu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration
T. L. Yang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates
Yue Gu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate
J. W. Jang et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints
Tianwei Hu et al.
MICROELECTRONICS RELIABILITY (2015)
Formation of octahedral corrosion products in Sn-Ag flip chip solder bump
Hanbyul Kang et al.
SCRIPTA MATERIALIA (2015)
Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing
Yong Zuo et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution
Ken'ichi Yokoyama et al.
CORROSION SCIENCE (2014)
Tin whisker growth from micro-alloyed SAC solders in corrosive climate
Balazs Illes et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2014)
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy
H. X. Xie et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
Youngseok Kim et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder
Subhasis Mukherjee et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Shear Strength of Eutectic Sn-Bi Lead-Free Solders After Corrosion Testing and Thermal Aging
Milad Mostofizadeh et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Interfacial microstructures and mechanical properties of Sn-9Zn-0.5Ga-xNd on Cu substrate with aging treatment
Peng Xue et al.
MATERIALS & DESIGN (2014)
Structure and properties of lead-free solders bearing micro and nano particles
Liang Zhang et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2014)
Effect of surface finishes on electromigration reliability in eutectic Sn-58Bi solder joints
Jae-Ha Kim et al.
MICROELECTRONIC ENGINEERING (2014)
Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy
Emmanuelle S. Freitas et al.
MICROELECTRONICS RELIABILITY (2014)
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging
JianXin Wang et al.
MICROELECTRONICS RELIABILITY (2014)
Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing
T. C. Huang et al.
SCRIPTA MATERIALIA (2014)
Failure analysis on electrolytic Ni/Au surface finish of PCB used for wire bonding and soldering
Fei-Jun Chen et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2014)
Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn-Ag-Cu solder joints
Zhongbao Yang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2013)
Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis
Xiao Hu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2013)
Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution
Udit Surya Mohanty et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder
Y. D. Han et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn-58Bi solder joint
Shafiq Ismathullakhan et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2013)
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process
P. J. Shang et al.
MICROELECTRONICS RELIABILITY (2013)
Beneficial effects of CeO2 addition on microstructure and corrosion behavior of electrodeposited Ni nanocrystalline coatings
Xiaowei Zhou et al.
SURFACE & COATINGS TECHNOLOGY (2013)
Origin and evolution of voids in electroless Ni during soldering reaction
C. Key Chung et al.
ACTA MATERIALIA (2012)
Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
Mingna Wang et al.
CORROSION SCIENCE (2012)
Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging
Liang Zhang et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2012)
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling
Y. D. Han et al.
INTERMETALLICS (2012)
Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging
Liang Zhang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing
Hongtao Chen et al.
MICROELECTRONICS RELIABILITY (2012)
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
Dhafer Abdulameer Shnawah et al.
MICROELECTRONICS RELIABILITY (2012)
Properties of SnZn lead free solders bearing rare earth Y
L. Zhang et al.
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING (2012)
Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect
T. Y. Kang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2011)
Evolution of nano-Ag3Sn particle formation on Cu-Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
L. C. Tsao
JOURNAL OF ALLOYS AND COMPOUNDS (2011)
Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints
Xiaoyan Li et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint
Jeong-Won Yoon et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution
Jing Hu et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Effects of electromigration on resistance changes in eutectic SnBi solder joints
Jia Sun et al.
JOURNAL OF MATERIALS SCIENCE (2011)
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
T.Y. Kang et al.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY (2011)
Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution
L. Hua et al.
MICROELECTRONICS RELIABILITY (2011)
Occurrence of tin pest on the surface of tin-rich lead-free alloys
Agata Skwarek et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2011)
Effects of humidity on tin whisker growth - Investigated on Ni and Ag underplated layer construction
Barbara Horvath et al.
THIN SOLID FILMS (2011)
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
Chih Chen et al.
ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 40 (2010)
Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements
Monika Leodolter-Dworak et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish
W. H. Wu et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging
Chien-Fu Tseng et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate
QingKe Zhang et al.
JOURNAL OF MATERIALS RESEARCH (2010)
Depressing effect of 0.1 wt.% Cr addition into Sn-9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Jin Hu et al.
MATERIALS CHARACTERIZATION (2010)
The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
Hsiu-Jen Lin et al.
MATERIALS LETTERS (2010)
Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study
M. Ghosh et al.
MATERIALS SCIENCE AND TECHNOLOGY (2010)
Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution
F. Rosalbino et al.
ELECTROCHIMICA ACTA (2009)
Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
Hsiu-Jen Lin et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple
Hongwen He et al.
JOURNAL OF MATERIALS SCIENCE (2009)
New Measurement of the Antiproton-to-Proton Flux Ratio up to 100 GeV in the Cosmic Radiation
O. Adriani et al.
PHYSICAL REVIEW LETTERS (2009)
Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate
H. F. Zou et al.
SCRIPTA MATERIALIA (2009)
Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution
Dezhi Li et al.
CORROSION SCIENCE (2008)
Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling
Yanghua Xia et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2008)
Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy
Wenxing Dong et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect
X. F. Zhang et al.
JOURNAL OF MATERIALS RESEARCH (2008)
Effect of thermal aging on drop performance of chip scale packages with SnAgCu solder joints on Cu pads
Weiqun Peng et al.
JOURNAL OF ELECTRONIC MATERIALS (2007)
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
Weiqun Peng et al.
MICROELECTRONICS RELIABILITY (2007)
Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
X. F. Zhang et al.
SCRIPTA MATERIALIA (2007)
Microstructure evolution during electromigration between Sn-9Zn solder and Cu
Shih-Ming Kuo et al.
JOURNAL OF MATERIALS RESEARCH (2007)
Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints
L. Zhang et al.
SCRIPTA MATERIALIA (2007)
Electromigration induced ductile-to-brittle transition in lead-free solder joints
Fei Ren et al.
APPLIED PHYSICS LETTERS (2006)
Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures
DZ Li et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu lead-free solder
J Zhao et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2004)
Total ionizing dose effects in bipolar devices and circuits
RL Pease
IEEE TRANSACTIONS ON NUCLEAR SCIENCE (2003)
Corrosion of tin alloys in sulfuric and nitric acids
M Mori et al.
CORROSION SCIENCE (2002)
Lead-free solders in microelectronics
M Abtew et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2000)