4.6 Article

Investigations on thermal properties of microencapsulated phase-change materials with different acrylate-based copolymer shells as thermal insulation materials

期刊

JOURNAL OF APPLIED POLYMER SCIENCE
卷 136, 期 31, 页码 -

出版社

WILEY
DOI: 10.1002/app.47777

关键词

applications; copolymers; morphology; surfaces and interfaces; thermal properties

资金

  1. Guangdong Province Higher Vocational Colleges & Schools Pearl River Scholar Funded Scheme (GDHVPS, 2016)
  2. Science and Technology Project of Shenzhen City in 2016 [JCYJ20160330101037385, JCYJ20160509100737182, JSGG20170414102704519]
  3. China Scholarship Council [201608440412]

向作者/读者索取更多资源

A series of microencapsulated phase-change materials (micro-PCMs) with binary cores and acrylate-based copolymer shells were prepared. The micro-PCMs contained octadecane and butyl stearate as binary-core materials. Allyl methacrylate, ethylene glycol dimethacrylate, 1,4-butanediol diacrylate (BDDA), and 1,6-hexanediol dimethacrylate were respectively introduced to copolymerize with divinylbenzene (DVB) to form different microcapsule shells. In this work, the influence of the types of core and shell materials and core-shell weight ratios on the thermal properties of micro-PCMs was studied. The chemical structures, morphologies, thermal properties, and thermal insulation properties of the wallboards were all tested and discussed. Scanning electron microscope photographs show that these micro-PCMs have relatively spherical profiles and compact surfaces with diameters ranging from 10 to 80 m. Differential scanning calorimetry results indicated that their microencapsulation efficiency ranged from 48 wt % to 80 wt %. A thermogravimetric analysis demonstrated that these micro-PCMs can ensure their thermal stability below 210 degrees C. Finally, a thermal insulation wallboard fabricated with synthesized P(BDDA-co-DVB) micro-PCMs showed excellent thermal energy storage performance, keeping the temperature fluctuation within 2.5 degrees C. (c) 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47777.

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