期刊
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
卷 134, 期 -, 页码 41-50出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2019.01.022
关键词
High-power laser diode array; Hybrid experimental/numerical method; Temperature distribution; Thermal resistance; Thermal design
资金
- National Key Research and Development Plan [2016YFB0402102]
- Scientific and Equipment Research Project, CAS [YZ201532]
- Critically Arranged Project, CAS [KGZD-SW-T01-1]
The accurate temperature measurement of high-power laser diode arrays is a considerable challenge due to their large temperature gradient and package structure. In this study, experiments based on the forward voltage method were set up to measure the transient temperature behavior of chips after the removal of heating load. A hybrid experimental/numerical method was developed to calculate multiple unknown interface thermal resistances and improve the prediction of the temperature distribution of high-power laser diode arrays by analyzing the transient temperature behavior of chips. The largest deviation between numerical and experimental results is 1.3 K. Based on the numerical results, thermal resistances for different layers and temperature distribution inside the chip were obtained and evaluated. Some suggestions for improving the thermal design of high-power laser diode arrays were derived. (C) 2019 Elsevier Ltd. All rights reserved.
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