期刊
IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 66, 期 4, 页码 1843-1848出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2019.2897258
关键词
Ag nanoparticles (NPs) seeds; electroless copper; metallization of nonconductive surfaces; polymer/Ag nanocomposite
资金
- Engineering and Physical Sciences Research Council through Photobioform II [EP/N018222/1, EP/N018265/2]
- EPSRC [EP/N018265/1, EP/N018265/2, EP/N018222/1, EP/L022133/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/N018265/2] Funding Source: researchfish
This paper presents a novel, direct, selective, vacuum-free, and low-cost method of electroless copper deposition, allowing additive patterning of nonconductive surfaces. Ag nanoparticles (NPs) synthesized inside a photosensitive polymer are acting as seeds for electroless copper deposition. The resulting copper film surface morphology was studied with scanning electron microscopy. Copper films were shown to display a rough grainlike structure, covering substrate uniformly with good metal-substrate adhesion. Copper thickness was studied as a function of the plating time, temperature, and Ag NPs seed concentration. A maximal copper thickness of 0.44 +/- 0.05 mu m was achieved when plated at 30 degrees C with 0.4 M Ag(I). The minimum feature resolution of copper patterns, grown with 0.025- and 0.1-M silver salt, is attained down to 10 mu m. The maximum electrical conductivity of the copper film prepared with 0.025-, 0.1-, and 0.4-M Ag(I) approaches (0.8 +/- 0.1) x 10(7) S/m, (1.1 +/- 0.1) x 10(7) S/m and (1.6 +/- 0.4) x 10(7) S/m, respectively. Electroless copper interconnections and LED circuit on glass substrate were fabricated as a proof of concept demonstrators.
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