4.6 Article

Method to Extract Interface and Bulk Trap Separately Over the Full Sub-Gap Range in Amorphous InGaZnO Thin-Film Transistors by Using Various Channel Thicknesses

期刊

IEEE ELECTRON DEVICE LETTERS
卷 40, 期 4, 页码 574-577

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2019.2898217

关键词

Density-of-state; interface state; InGaZnO thin-film transistor

资金

  1. National Research Foundation of Korea (NRF) through the Korean Government [Ministry of Education, Science and Technology (MEST)] [2016R1A5A1012966, 2017R1A2B4006982, 18ZB1800, 2016M3A7B4909668]
  2. Institute for Information & Communication Technology Planning & Evaluation (IITP), Republic of Korea [18ZB1800] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

向作者/读者索取更多资源

We propose an experimental method to decompose the interface (insulator/channel) trap density (Dit) and sub-gap density-of-state in the entire defect (gtot) of amorphous InGaZnO (a-IGZO) thin-film transistors (TFTs). This method involving various active layers of different thicknesses is used for determining the origin of defects and for process optimization. These results can be used to determine clearly the contributions to the origin of the defect. Oxygen-related and deep states near the conduction band minimum (EC) were strongly affected by the interface region. Tail states near EC, on the other hand, were strongly influenced by the active layer. The proposed method provides physical insight and key guidelines for optimizing the performance of a-IGZO TFTs.

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