Stress states and crack behavior in plasma sprayed TBCs based on a novel lamellar structure model with real interface morphology

To ascertain the crack growth behavior and coalescence mechanism in thermal barrier coatings (TBCs) is beneficial for understanding the failure of TBCs and proposing the probable optimization methods. In this work, a novel lamellar structure model with real interface morphology is developed to explore the crack growth behavior and the failure mechanism of TBCs during thermal cycling. Three typical defects which include pore, inter-splat crack, and intra-splat are incorporated in the model. To simulate the oxidation process of the bond coat (BC) realistically, The oxidation growth process is simulated via changing the BC properties to thermally grown oxide (TGO) properties layer by layer. The effects of the lateral growth strain distribution through TGO thickness on the stress states are executed. Moreover, the influences of BC creep on the crack growth and coating lifetime are further elaborated. The results show that the larger the lateral growth strain gradient, the smaller the residual tensile stress. The irregular interface morphology results in the redistribution of residual stresses. Although the pores and cracks can alleviate the tensile stress near the valley, large stress concentration will occur near them. At the early phase of thermal cycling, the cracks grow steadily. After more cycles, the cracks propagate rapidly and merge with others. The simulated delamination path is in agreement with the experiment results. Not only does BC creep change the crack coalescence mechanism, it also decreases the thermal cyclic lifetime of TBCs. The coating optimization method proposed in this study provides another option for developing advanced TBCs with longer lifetime.