Enhanced ductility of W-Mo-Cu alloy through the formation of nanometer-to-micrometer-thick dual-phase transition phase layer

Adding an appropriate interfacial layer is a viable way to decrease the W-Wcontiguity and enhance the interfacial bonding of W-Cu alloy simultaneously, hence increase the tensile ductility. In this regard, we prepared a new kind of W-Mo-Cu alloy with transition phase (TP) existing between W particles and Cu matrix using infiltration method. The TP consisting of amorphous and nanocrystalline structure is formed between the W particles and the Cu matrix. The formation of the TP simultaneously decreases the W-Wcontiguity and enhances bonding with both W particles and Cu matrix, leading to the good tensile ductility of the W-Mo-Cu alloy. The underlying formation mechanism of the TP is thoroughly studied. The W-Mo-Cu alloy exhibits excellent ductility under both compressive and tensile loading at room temperature. Under the quasi-static tensile loading, the critical failure strain of the W-Mo-Cu alloy is 0.18. Our analysis demonstrates that a strong bonding is formed between the TP and the adjacent phases. (C) 2018 The Authors. Published by Elsevier Ltd.