期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 9, 期 3, 页码 458-472出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2018.2860961
关键词
Capillary-fed boiling; dryout; evaporator wick; high-heat-flux dissipation; thermal resistance; two-layer wick; vapor chamber
类别
资金
- Toyota Motor Engineering and Manufacturing North America, Inc.
A hybrid two-layer evaporator wick is proposed for passive, high-heat-flux dissipation over large areas using a vapor chamber heat spreader. For such applications, the evaporator wick layer must be designed to simultaneously minimize the device temperature rise and minimize the flow resistance to a capillary feeding of the wick. This requires a strategy that exploits the benefits of a thin wick for reduced thermal resistance and a thick wick for liquid feeding. In the present design, a thick cap layer of wick material evenly routes liquid to a thin, low-thermal-resistance base layer through an array of vertical liquidfeeding posts. This two-layer structure decouples the functions of liquid resupply (cap layer) and capillary-fed boiling heat transfer (base layer), making the design scalable to heat input areas of similar to 1 cm(2) for operation at 1 kW/cm(2). A reduced-order model is developed to demonstrate the potential performance of a vapor chamber incorporating such a two-layer evaporator wick design. The model comprises simplified hydraulic and thermal resistance networks for predicting the capillary-limited maximum heat flux and the overall thermal resistance, respectively. The reduced-order model is validated against a higher fidelity numerical model and then used to analyze the performance of the vapor chamber with varying two-layer wick geometric feature sizes. The two-layer wick design is found to sustain liquid feeding at higher heat fluxes, without reaching the capillary limit, compared to single-layer evaporator wick designs.
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