期刊
ROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING
卷 55, 期 -, 页码 65-75出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.rcim.2018.07.005
关键词
Robotic polishing; Electrochemical mechanical polishing; End-effector; Force control
资金
- A*STAR Industrial Robotics Program Science and Engineering Research Council [122510004]
- State International Science and Technology Cooperation Special Items [2015DFA11700]
- Frontier and Key Technology Innovation Special Funds of Guangdong Province [2014B090919002, 20158010917003]
- Program of Foshan Innovation Team of Science and Technology [2015IT100072]
In this paper, we present a novel design of a robotic electrochemical mechanical polishing (ECMP) process. Firstly, the process is presented to replace the conventional ECMP process by a robotic-based one. The advantage of using industrial robots lies in their flexibility, reconfigurability, large workspace and low prices compared to the conventional systems. Secondly, a novel design of a force-controlled end-effector for this purpose is presented. The end-effector is integrated into a macro-mini robot polishing cell. The macro robot (an industrial robotic manipulator) is used to position the mini robot (the proposed end-effector) according to the workpiece profile while the mini robot controls the polishing force. The effectiveness of the proposed device to polish un-milled and milled surfaces has been examined through polishing experiments. The results demonstrate the effectiveness of the presented device to reduce the surface roughness and improve the reflectability and appearance.
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