Mechanical simulation of foldable AMOLED panel with a module structure

The stress analysis of the flexible AMOLED panel is a fundamental study for designing optimal structures with good foldability. Current research assumes linear elastic models. In the present work, A visco-hyperelastic constitutive model was employed to describe the nonlinear behavior of the optically clear adhesive (OCA). The finite element method for simulating the folded panel was constructed to analyze the effect of panel structure on the stress and strain distributions. Compared with the bending state of the single device, the flexible panel module is shown to have multiple neutral planes. The maximum longitudinal stress of the AMOLED device is located at the folding symmetry, while the maximum strain in the OCA layer is located at the transition area between the bending and unbending areas. Finally, the simulated results show that increasing the thickness of the first OCA layer which located between the cover window and the polarizer is more efficient for preventing peeling effect or delamination occurred to the panel.