期刊
MACROMOLECULAR RAPID COMMUNICATIONS
卷 40, 期 17, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/marc.201800805
关键词
boron nitride; 3D networks; polyimide; thermal conductivity
资金
- National Natural Science Foundation of China [21676217, 51473135, 51503170] Funding Source: Medline
Easy and high efficient methods are in great demand to obtain polyimide (PI) composites with high thermal conductivity in the electronic packaging field. In this work, PI/boron nitride (BN) composites with high thermal conductivity are easily fabricated. Tightly connected and well-arranged BN platelets construct effective 3D thermally conductive networks in the PI matrix upon hot pressing, after BN platelets are coated on the surface of PI granules by the help of a kind of PI adhesive. The thermal conductivity of the PI/BN composites reaches as high as 4.47 W mK(-1) at a low BN loading of 20 vol%, showing an enhancement of 2099%, compared to pure PI. Such enhancement of the thermal conductivity is the highest compared with the results in the open literature. Our work is a good example that utilized the sufficient physical connection (aggregates) of thermally conductive fillers to significantly promote the thermal conductivity of polymer composites.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据