期刊
IEICE TRANSACTIONS ON ELECTRONICS
卷 E102C, 期 2, 页码 176-179出版社
IEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG
DOI: 10.1587/transele.2018OMS0009
关键词
gold leaf; gold powder; gold particles; conductive ink; percolation network
资金
- JSPS KAKENHI [JP16K21061, JP18K05256]
In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2 k Omega to 1 Omega by adding only 2.0 wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
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