期刊
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
卷 117, 期 -, 页码 11-22出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2018.11.006
关键词
Nanocomposites; Graphene; Short carbon fiber; Thermal properties
资金
- National Key R&D Program of China [2016YFC0207104]
- Guangdong Innovative and Entrepreneurial Research Team Program [2014ZT05C146]
- Huizhou Innovative and Entrepreneurial Research Team Program [20150317025954531]
- National Natural Science Foundation of China [11832010, 11225210]
- University of Chinese Academy of Sciences
High filler loading in polymer alone cannot meet the increasing requirements of the electronic industry, so the hybrid fillers with unique advantages have been developed. In this work, chemical exfoliation and mechanical mixing are combined to disperse hybrid fillers of graphene nanoplatelets (GNPs) and boron nitride (BN) nanoplatelets inside short carbon fibers (SCF) based epoxy matrix. Such surface modified hybrid fillers/epoxy nanocomposites exhibit a high thermal conductivity of ca. 0.8 W m(-1) K-1 and an electrical volume resistivity of ca. 6.41 x 10(15) Omega cm at a low filler loading of 3 wt% SCF + 5 wt% modified GNP-BN. Furthermore, the thermal stability, heat dissipation and absorption properties are enhanced for the ternary hybrid fillers/epoxy nanocomposites. Overall, such a system offers an outstanding approach for the electronic industry to enhance the thermal conductivity without compromising the electrical insulation property of epoxy materials.
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