4.8 Article

A Versatile Approach for Direct Patterning of Liquid Metal Using Magnetic Field

期刊

ADVANCED FUNCTIONAL MATERIALS
卷 29, 期 28, 页码 -

出版社

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.201901370

关键词

3D liquid metal patterning; flexible electronics; liquid metal; magnetic patterning; wearable sensor

资金

  1. Global Experts Recruitment Program of China
  2. Innovative and Entrepreneurial Talent Recruitment Program of Jiangsu Province
  3. State Key Project of Research and Development [2016YFF0100802]
  4. Fundamental Research Funds for the Central Universities [2242018K41023]
  5. Scientific Research Foundation of Graduate School and Excellence Project of Southeast University [YBJJ1830]
  6. Key Project of State Key Laboratory of Bioelectronics, Southeast University
  7. Open Research Fund of State Key Laboratory of Bioelectronics, Southeast University

向作者/读者索取更多资源

Patterning of liquid metal (LM) is usually an integral step toward its practical applications. However, the high surface tension along with surface oxide makes direct patterning of LM very challenging. Existing LM patterning techniques are designed for limited types of planar substrates, which require multiple-step operation, delicate molds and masks, and expensive equipment. In this work, a simple, versatile, and equipment-free approach for direct patterning of LM on various substrates using magnetic field is reported. To achieve this, magnetic microparticles are dispersed into LM by stirring. When a moving magnetic field is applied to the LM droplet, the aggregated magnetic microparticles deform the droplet to a continuous line. In addition, this approach is also applicable to supermetallophobic substrates since the applied magnetic field significantly enhances the contact between LM and substrate. Moreover, remote manipulation of the magnetic microparticles allows direct patterning of LM on nonplanar surfaces, even in a narrow and near closed space, which is impossible for the existing techniques. A few applications are also demonstrated using the proposed technique for flexible electronics and wearable sensors.

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