4.7 Article

Crystallographic relationships of T-/S-phase aggregates in an Al-Cu-Mg-Ag alloy

期刊

ACTA MATERIALIA
卷 166, 期 -, 页码 587-596

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2018.12.036

关键词

Aluminium alloy; Orientation relationships; Dispersoid-precipitate aggregate; ACOM-TEM; Scanning precession electron diffraction

资金

  1. AMPERE project [NFR247783]
  2. Research Council of Norway
  3. Hydro
  4. Granges
  5. Neuman Aluminium Raufoss (Raufoss Technology)
  6. Nexans
  7. Research Council of Norway [NFR221714]
  8. ERC [291522-3DIMAGE]
  9. EPSRC [EP/R008779/1]
  10. EPSRC NanoDTC Cambridge [EP/L015978/1]
  11. University of Cambridge
  12. EPSRC [EP/R008779/1] Funding Source: UKRI

向作者/读者索取更多资源

T-(Al20Cu2Mn3) phase dispersoids are important for limiting recovery and controlling grain growth in Al-Cu alloys. However, these dispersoids can also reduce precipitation hardening by acting as heterogeneous nucleation sites and may lead to increased susceptibility towards pitting corrosion when galvanically coupled with S-(Al2CuMg) phase precipitates. The interplay between T- and S-phases is therefore important for understanding their effect on the mechanical and electrochemical properties of Al-Cu-Mg alloys. Here, the crystallographic relationships between the T-phase, S-phase, and surrounding Al matrix were investigated in an Al-1.31Cu-1.14Mg-0.13Ag-0.10Fe-0.28Mn (at.%) alloy by combining scanning precession electron diffraction with misorientation analysis in 3-dimensional axis-angle space and high-resolution transmission electron microscopy. Orientation relationships are identified between all three phases, revealing S-T orientation relationships for the first time. Differences in S-Al orientation relationships for precipitates formed at T-phase interfaces compared to their non-interfacial counterparts were also identified. These insights provide a comprehensive assessment of the crystallographic relationships in T-/S-phase aggregates, which may guide future alloy design. (C) 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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