期刊
SCIENCE
卷 362, 期 6415, 页码 665-+出版社
AMER ASSOC ADVANCEMENT SCIENCE
DOI: 10.1126/science.aat8126
关键词
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资金
- NSF [CMMI-1825731, CMMI-1825256, DMR-1700137]
- French National Research Agency
- MII Lincoln Laboratory Technology Office
- Assistant Secretary of Defense for Research and Engineering
- ONR [N00014-16-1-2657]
- STC Center for Integrated Quantum Materials under NSF grant [DMR-1231319]
- Assistant Secretary of Defense for Research and Engineering under Air Force contract [FA8721-05-C-0002, FA8702-15-D-0001]
- NEWLIMITS, a center in nCORE, a Semiconductor Research Corporation (SRC) program - NIST [70NANB17H041]
- MIT-MI one-on-one project
Although flakes of two-dimensional (2D) heterostructures at the micrometer scale can be formed with adhesive-tape exfoliation methods, isolation of 2D flakes into monolayers is extremely time consuming because it is a trial-and-error process. Controlling the number of 2D layers through direct growth also presents difficulty because of the high nucleation barrier on 2D materials. We demonstrate a layer-resolved 2D material splitting technique that permits high-throughput production of multiple monolayers of wafer-scale (5-centimeter diameter) 2D materials by splitting single stacks of thick 2D materials grown on a single wafer. Wafer-scale uniformity of hexagonal boron nitride, tungsten disulfide, tungsten diselenide, molybdenum disulfide, and molybdenum diselenide monolayers was verified by photoluminescence response and by substantial retention of electronic conductivity. We fabricated wafer-scale van der Waals heterostructures, including field-effect transistors, with single-atom thickness resolution.
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