期刊
MICROELECTRONICS RELIABILITY
卷 91, 期 -, 页码 283-290出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2018.10.014
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资金
- National Research Foundation of Korea (NRF) - Ministry of Education [NRF2016R1D1A1B03932859]
- Kangwon National University [520160277]
- National Research Foundation of Korea (NRF) - Ministry of Science, ICT and Future Planning [2009-0082580]
- National Research Foundation of Korea [31Z20130012978] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
A comparative study of the differences in the interfacial behaviors of thermally aged bare Cu wire, Pd-coated Cu wire and Pd-Au-coated Cu wire with Al pad was conducted using scanning electron microscopy and transmission electron microscopy. During high-temperature lifetime testing of these wires bonded with Al pads at 150 degrees C for up to 1500 h, different growth rates and growth characteristics were investigated in Cu-Al intermetallic compounds (IMCs), in this case Cu9Al4, CuAl and CuAl2. Because continuously uniform distributions of Pd and Pd-Au in the Cu wire formed in the upper IMC area, the bonding reliability and the IMC growth rate were improved. The formation of a completely solid solution was considered to have improved the bonding reliability by protecting the IMC from the propagation of micro-cracks.
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