期刊
JOURNAL OF MEMBRANE SCIENCE
卷 570, 期 -, 页码 314-321出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.memsci.2018.10.057
关键词
Thin-film composite membrane; Polyamide rejection layer; Copper nanoparticles; Nanovoids; Water permeability
资金
- Seed Funding for Strategic Interdisciplinary Research Scheme, the University of Hong Kong
Thin film nanocomposite (TFN) membranes, which incorporate nanomaterials in a crosslinked polyamide matrix, often show enhanced separation properties thanks to the additional pores or channels offered by these materials. In this study, we deliberately created nanovoids in the dense polyamide rejection layer by acid-etching copper nanoparticles (CuNPs) contained in a TFN membrane. Systematic membrane characterization confirmed the complete removal of CuNPs using 1% HNO3, which formed nanovoids of approximately 10 nm in size. The water flux of the etched membrane TFC-Cu50X was nearly quadrupled compared to that of the CuNPs loaded membrane TFC-Cu50. This significantly improved water flux can be ascribed to the enhanced water transport through these nano-sized voids. The nanovoids-enhanced approach provides new possibilities for synthesizing high performance membranes.
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