A simulation study on the multi-pass rolling bond of 316L/Q345R stainless clad plate

This article describes an investigation into interface bonding research of 316L/Q345R stainless clad plate. A three-dimensional thermal-elastic-plastic model has been established using finite element analysis to model the multi-pass hot rolling process. Results of the model have been compared with those obtained from a rolling experiment of stainless clad plate. The comparisons of temperature and profile of the rolled stainless clad plate have indicated a satisfactory accuracy of finite element analysis simulation. Effects on interface bonding by different parameters including pre-heating temperature, multi-pass thickness reduction rules, rolling speed, covering rate, and different assemble patterns were analyzed systematically. The results show that higher temperature and larger thickness reduction are beneficial to achieve the bonding in vacuum hot rolling process. The critical reduction in the bond at the temperature of 1200 degrees C is 28%, and the critical thickness reduction reduces by about 2% when the temperature increases by 50 degrees C during the range from 1000 degrees C to 1250 degrees C. And the relationship between the minimum pass number and thickness reduction has been suggested. The results also indicate that large covering rate in the assemble pattern of outer soft and inner hard is beneficial to achieve the bond of stainless clad plate.