4.8 Article

Stretching and Breaking of Ultrathin 2D Hybrid Organic-Inorganic Perovskites

期刊

ACS NANO
卷 12, 期 10, 页码 10347-10354

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsnano.8b05623

关键词

2D hybrid organic-inorganic perovskite; mechanical property; in-plane; AFM indentation; layer dependence

资金

  1. Soft and Hybrid Nanotechnology Experimental (SHyNE) resource [NSF ECCS-1542205]
  2. MRSEC program at the Materials Research Center
  3. the International Institute for Nanotechnology (IIN) [NSF DMR-1720139]
  4. Keck Foundation
  5. State of Illinois, through the IIN
  6. National Science Foundation IDBR Grant Award [1256188]
  7. Air Force Research Laboratory [FA8650-15-2-5518]
  8. ONR [N00014-17-1-2231]

向作者/读者索取更多资源

Two-dimensional (2D) hybrid organic-inorganic perovskites (HOIPs) are recent members of the 2D materials family with wide tunability, highly dynamic structural features, and excellent physical properties. Ultrathin 2D HOIPs and their heterostructures with other 2D materials have been exploited for study of physical phenomena and device applications. The in-plane mechanical properties of 2D ultrathin HOIPs are critical for understanding the coupling between mechanical and other physical fields and for integrated devices applications. Here we report the in-plane mechanical properties of ultrathin freestanding 2D lead iodide perovskite membranes and their dependence on the membrane thickness. The in plane Young's moduli of 2D HOIPs are smaller than that of conventional covalently bonded 2D materials. As the thickness increases from monolayer to three-layer, both the Young's modulus and breaking strength decrease, while three layer and four-layer 2D HOIPs have almost identical in-plane mechanical properties. These thickness-dependent mechanical properties can be attributed to interlayer slippage during deformation. Our results show that ultrathin 2D HOIPs exhibit outstanding breaking strength/Young's modulus ratio compared to many other widely used engineering materials and polymeric flexible substrates, which renders them suitable for application into flexible electronic devices.

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