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Electrodeposition of Alloys and Compounds in the Era of Microelectronics and Energy Conversion Technology

期刊

COATINGS
卷 5, 期 2, 页码 195-218

出版社

MDPI
DOI: 10.3390/coatings5020195

关键词

electrodeposition; electrochemical film growth; alloy deposition; underpotential deposition

资金

  1. NSF [CMMI 1131571, DMR 1207351]
  2. Directorate For Engineering
  3. Div Of Civil, Mechanical, & Manufact Inn [1131571] Funding Source: National Science Foundation

向作者/读者索取更多资源

Electrochemical deposition methods are increasingly being applied to advanced technology applications, such as microelectronics and, most recently, to energy conversion. Due to the ever growing need for device miniaturization and enhanced performance, vastly improved control of the growth process is required, which in turn necessitates a better understanding of the fundamental phenomena involved. This overview describes the current status of and latest advances in electrodeposition science and technology. Electrochemical growth phenomena are discussed at the macroscopic and atomistic scale, while particular attention is devoted to alloy and compound formation, as well as surface-limited processes. Throughout, the contribution of Professor Foresti and her group to the understanding of electrochemical interfaces and electrodeposition, is highlighted.

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